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Figure/Table detail

Spatial Agglomeration Identification and Agglomeration Zoning of Semiconductor Industry in China
JIANG Xiaorong, LIU Qing
Economic geograph, 2024, 44(3): 108-117.   DOI: 10.15957/j.cnki.jjdl.2024.03.011

企业类型 芯片设计 晶圆材料 封测材料 封装测试 半导体制造 终端设备生产 总量
半导体企业数量(家) 3837 1767 2165 1841 3020 3127 15757
投资分支企业数量(家) 2141 2022 1300 1526 1671 1406 10066
Tab.1 Data on Chinese semiconductor enterprises and their investment branches
Other figure/table from this article
  • Fig.1 Framework and technological roadmap of agglomeration zone of China’s semiconductor industry
  • Fig.2 Hotspot identification of China semiconductor industry based on the locational quotient
  • Fig.3 Overall network pattern of China’s semiconductor industry agglomeration based on outward and local investment of semiconductor enterprises
  • Fig.4 Regional network of China’s semiconductor industry agglomeration based on investment linkages of semiconductor enterprises
  • Fig.5 Pathway distribution of minimum weight spanning tree based on the spatial contiguity graph
  • Fig.6 The results of semiconductor agglomeration area network partitioning with approximately maximized modularity
  • Fig.7 Second-level zoning scheme for the spatial agglomeration of China semiconductor industry
  • Tab.2 Indicators statistics of second-level zoning for the spatial agglomeration of the Chinese semiconductor industry

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