Economic geography

Spatial Agglomeration Identification and Agglomeration Zoning of Semiconductor Industry in China

JIANG Xiaorong, LIU Qing

Economic geograph, 2024, 44(3): 108-117. DOI: 10.15957/j.cnki.jjdl.2024.03.011

企业类型	芯片设计	晶圆材料	封测材料	封装测试	半导体制造	终端设备生产	总量
半导体企业数量（家）	3837	1767	2165	1841	3020	3127	15757
投资分支企业数量（家）	2141	2022	1300	1526	1671	1406	10066

Tab.1 Data on Chinese semiconductor enterprises and their investment branches

Other figure/table from this article

Fig.1 Framework and technological roadmap of agglomeration zone of China’s semiconductor industry
Fig.2 Hotspot identification of China semiconductor industry based on the locational quotient
Fig.3 Overall network pattern of China’s semiconductor industry agglomeration based on outward and local investment of semiconductor enterprises
Fig.4 Regional network of China’s semiconductor industry agglomeration based on investment linkages of semiconductor enterprises
Fig.5 Pathway distribution of minimum weight spanning tree based on the spatial contiguity graph
Fig.6 The results of semiconductor agglomeration area network partitioning with approximately maximized modularity
Fig.7 Second-level zoning scheme for the spatial agglomeration of China semiconductor industry
Tab.2 Indicators statistics of second-level zoning for the spatial agglomeration of the Chinese semiconductor industry